Diamond–copper composite material
Product Category:
Diamond–copper composite material
Keywords:
Diamond–copper composite material, thermal management for power device packaging, thermal conductivity > 800 W/(m·K)
Product Features
Product Details
Low-cost diamond–copper composites with a thermal conductivity exceeding 800.
Product Message
If you would like to learn more, please send us an email. You are also welcome to call our company—our customer service representatives will be happy to assist you!
Contact Us
Telephone:0794-6621913
Fax: 0794-6621923
Mobile phone:13322858580 (Mr. He)
Mobile phone:17779426086(Miss Zheng)
Email:614139948@qq.com
Website:http://www.jhldcl.com/
Address: Houfa Industrial Park, Le’an County, Fuzhou City, Jiangxi Province
WeChat Official Account
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