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Diamond heat sink material

Product Category:

Diamond heat sink material

Keywords:

Diamond heat sink, for high-power silicon-based and laser chip thermal management, with a thermal conductivity exceeding 2000 W/(m·K).


Product Features

Product Features: Diamond heat sink series, suitable for thermal management of high-power lasers, RF devices, and power chips, with a thermal conductivity exceeding 2000 W/(m·K).

Product Details


Materials Science

Product Message

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