Diamond heat sink material
Product Category:
Diamond heat sink material
Keywords:
Diamond heat sink, for high-power silicon-based and laser chip thermal management, with a thermal conductivity exceeding 2000 W/(m·K).
Product Features
Product Features: Diamond heat sink series, suitable for thermal management of high-power lasers, RF devices, and power chips, with a thermal conductivity exceeding 2000 W/(m·K).
Product Details
Materials Science
Product Message