Diamond–copper composite material, thermal management for power device packaging, thermal conductivity > 800 W/(m·K)

Diamond heat sink, for high-power silicon-based and laser chip thermal management, with a thermal conductivity exceeding 2000 W/(m·K).

It is suitable for cylindrical batteries employing layered oxide or polyanionic cathodes paired with hard carbon anodes, exhibiting excellent thermal stability and cycling performance.

Suitable for prismatic and pouch cells with NCM523/622/811 cathodes paired with graphite anodes, offering both high- and low-temperature performance as well as long cycle life.